||Inspection and test criteria will be based upon IPC-A-600 and IPC-6012, Class 2 unless otherwise specified on customer drawings or specifications.
||Single side boards: FR-1, FR-2 or FR-4 glass epoxy laminate per IPC-41011 with a minimum Tg 110 C. Starting clad copper weight to be 1 oz./ft2 minimum.
Double sided plated-through boards: King Baord, FR-4 glass epoxy laminate per IPC-4101 with a minimum Tg of 130 C. Starting clad copper weight to be 0.5 oz./ft2 minimum.
Multilayer boards: King Board, FR-4 copper-clad glass-epoxy (tine core) and laminateand material (prepreg) per IPC-4101with a minimum Tg of 135 C Starting clad copper weight to be 1 oz./ft2 minimum on all internal layers and 0.5 oz./ft2 minimum on external layers.
||Holes with copper pads on both sides are to be copper plated through. Copper plating thickness will be in accorde with IPC-6012, Class 2 (0.0008" avg. minimum thickness). When copper pads on artwork are smaller or the same size as the corresponding finished holes, SCT will regard the hole as not requiring plating.
||Copper features exposed by solder mask, except nickel / gold plated edge contacts, will be coated by Hot Air Solder Leveling (HASL). SCT monitors the HASL processes to ensure that boards meet the solderability requirements of IPC6012 class 2.
|Nickel/gold Plated surfaces
||Nickel/gold plated surfaces: For contact surfaces: a minimum thickness of 0.8 gold over 150 nickel; and for solderable surfaces.
||Finished plated through hole size tolerances will be in accordance with IPC-D-300, Class 2:
Finished holes up to 0.032" ... 0.003"
Finished holes from 0.033" to 0.063" ... 0.004"
Finished holes from 0.064" and larger ... 0.006"
||Green Liquid Photo Imageable solder mask (LPI) will be applied over bare copper traces. The mask material will comply with IPC-SM-840 Type B, Class II. Unless specifically prohibited by the customer.
||When required, nomenclature will be printed on the component side of the board with white non-conductive epoxy ink or acrylate equivalent.
|Bow and twist
||Bow and twist will not exceed 0.75% for boards bearing surface SMT mount components, and 1.5% for all other boards.
||Unless otherwise specified, thickness tolerances will be 10% of the finished board thickness, not including surface copper.