Client Success Stories (with Photos)

Case Studies

Technical Cases, DFM Reviews & Customer Stories

High-layer HDI, heavy copper, fine-line impedance — and the DFM calls that kept them shippable.

A

Technical Capabilities

4 representative builds

26-layer 7-step HDI test board
HDI · IT180A

28-Layer HDI in IT180A with 28:1 Aspect Ratio

High aspect ratio & super-thick multilayer HDI is a core strength at SPCB. We solve complex stacking, plating and impedance challenges for industrial control & communication high-end equipment.

Material: IT180A28-layer HDIAspect 28:1 Copper 2/2 oz360×360 mm5.0 mm thick
12-layer 3-step HDI optical-module board
DFM · HDI

DFM Best Practices for HDI

Want more routing space on your HDI board? Two DFM details matter most:

  • Conductor width & clearance — finer lines and tighter clearances free routing channels.
  • Microvia sizing — smaller drill openings / annular rings save board space.
  • Microvia drill 3–6 mils widely recommended.
  • Class 3: min 8 mil drill, 4 mil minimum annular ring.
Resin-plugged via board for dense BGA
Fine Line · Impedance

2.8/2.8 mil Fine Line with Differential Impedance & BGA

At the sharp edge of HDI: 2.8/2.8 mil lines under dense BGA, where impedance discontinuity and reflection most often appear. We validate:

  • Uniform 2.8/2.8 mil geometry across BGA escape.
  • Stable differential impedance with tight tolerance.
  • Controlled etch profile for consistent trace width.
  • Layer registration & stack-up optimisation.
  • Impedance coupon testing before shipment.
16-layer gold-finger board
Composite Process

Multiple Advanced Requirements on One Board

This build integrates several demanding processes:

  • Resin plug + staggered vias for flat BGA surface.
  • 2u" ENIG over board + 30u" hard gold for gold fingers.
  • Balanced copper lamination to minimise warpage.

Widely applied in smart manufacturing, medical, automotive and AI hardware.

B

DFM Insights

3 lessons from real enquiries

12-layer 2-step HDI high-power board
Spec Conflict

Gerber vs. Spec Sheet

5 sets of files, 10 pcs each — but the Gerber called for PI + thermal copper paste via filling, while the spec sheet said FR4 TG170 + resin plug vias. On a 4 oz heavy-copper high-current board, the via-filling method directly impacts thermal performance.

We flagged the conflict before quoting; the client finalised the process based on our input, and we re-quoted with FR4 options.

A pre-quotation DFM review surfaces conflicting specs before you commit to fabrication.
6-layer metal-edge / castellated board
Routing

0.9 mm Breakaway Tabs Separating Early

A customer's breakaway tabs were only 0.9 mm wide and separating too early during routing. Our engineering review proposed two changes:

  • Modify the routing outline to improve tab strength.
  • Offset the cut 0.2 mm inward into the tabs to reduce burrs.

The customer's reply: "Please follow production Gerber." A small DFM adjustment at the file stage avoided a downstream yield issue.

We review designs before manufacturing, not after.
12 oz heavy-copper charger board
Via Copper

"PTH Hole Copper 35 µm" — Usually a Mistake

A drawing specified 35 µm hole copper on an HDI board. We paused the order and confirmed, because this note is normally written by mistake:

  • Plating chemistry can't reach the microvia centre (voids → scrap).
  • 70–80 µm surface copper ruins 3–4 mil traces by side-etching.
  • "35 µm / 1 oz" is usually meant for surface copper, not hole wall.
Confirm before production — always cheaper than rework.
C

Customer Success

3 detailed case studies

6-layer industrial-control board
EuropeMedical6-layer HDIIPC Class III

6-Layer HDI PCB for Portable Medical Diagnostic Equipment

Tech Spec

0.4 mm pitch BGA, laser microvias, ENIG finish, IPC Class III reliability.

Outcome

SPCB's DFM review caught a critical hidden BGA microvia defect before build. Boards ship consistent, with complete documentation and reliable communication.

"SPCB's DFM review saved our medical project from a critical hidden defect. Your engineers actively spot BGA microvia risks and give practical improvement suggestions."— R&D Director, Medical Device Company (Europe)
20 oz high-power motor board
USAPower / Renewable12-layer3 oz copper

12-Layer Heavy Copper PCB for Low-Voltage Switchgear & Solar

Challenge

A previous fabricator's inconsistent resin plugging caused thermal hotspots and failed safety audits under continuous high-current load.

Solution

DFM review of copper balance, current paths and anti-arc creepage/clearance; tuned stack-up, 100% flying-probe test, thermal-impedance sampling, resin-void inspection.

Outcome

All boards passed IEC anti-arc verification; void rate well below limit. A qualified solution with repeat orders for over 10 years.

"SPCB fully understood our IEC anti-arc requirements from the DFM stage. Heavy copper and resin plug vias are executed consistently."— Senior Electrical Engineer, Power Equipment Manufacturer
14-layer industrial-control board
AustriaIndustrial Automation10-layer±5% Impedance

Controlled-Impedance Multilayer PCB for Industrial Motion Controller

Challenge

A startup racing field validation needed fast-turn prototypes with precise differential impedance and durable gold fingers; prior vendors missed tolerance or lead time.

Solution

Rapid prototyping line (24h expedited), impedance coupons on every panel, plated gold fingers, full flying-probe test, cross-section samples and full test reports.

Outcome

Impedance within ±5%; gold fingers passed insertion-cycle tests; samples shipped on schedule — design locked before mass production.

"All OK! Well-packaged, good quality, and included a test report and cut-out. I was especially pleased with the nice, personal note."— Hardware Lead, Industrial Automation Co.

Have a similar build?

Send us your Gerber — our engineering team reviews it before production.

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