Description |
Technology & Capabilities |
|
Product Range |
Rigid PCBs from 2 - 24 layers, HDI; Aluminium base |
2. |
Min. Board Thickness |
2 layer |
4 layer |
6 layer |
8 layer |
10 layer |
min. 0.2mm |
0.40mm |
1.00mm |
1.20mm |
1.50mm |
|
12 & 14 layer |
16 layer |
18 layer |
20 layer |
22&24 layer |
1.60mm |
1.7mm |
1.8mm |
2.2mm |
2.6mm |
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3. |
Max. Board Size |
610 x 1200mm (24.0" x 47.2") |
|
Base Material |
FR-4 Glass Epoxy laminate, Aluminium base, RCC |
5. |
Surface Finish Treatment |
Electroless nickel Immersion gold (Electroless Ni/Au), Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (Lead- Free, RoHS), Carbon Ink,
Peelable Mask. Gold Fingers (30µ"), Immersion Silver (3~10u"); Immersion Tin (0.6~1.2um) Flash gold (Electrolytic). |
|
Major Laminate |
King Board (KB-6150), ShengYi (S1141; S1170),Arlon, YGA-1-1;Rogers and others |
|
Via Holes |
Copper PTH / Blind Via / Buried Via / HDI 2+N+2 with IVH |
8. |
Copper Foil Thickness |
18um / 35um / 70um ~ 245um (outerlayer:0.5oz~7oz)
18um / 35um / 70um ~ 210um (innerlayers:0.5oz~6oz) |
9. |
Min. Via Size and Type |
Dia. 0.15mm (Finished);
Aspect Ratio = 12 ; HDI holes (<0.10mm) |
10. |
Min. Line width & Spacing |
0.75 mm / 0.10 mm (3 mil./ 4 mil.) |
11. |
Min. via hole size and pad |
via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via |
|
Impedance l Control Tol. |
+/-10% (min. +/-7 Ohm) |
|
Solder Mask |
Liquid Photo-image (LPI) |
|
Profiling |
CNC Routing, V-cutting, Punching, Push Back Punching, Connector chamfering |
|
Capacity |
100km2 output / monthly |
We provide the finest details of our capabilities to produce the world-class PCBs. The hole diameter, thickness of copper foil, material length, and other descriptions are needed to check very carefully against our process capablity. This is where we spend our maximum effort. Check with our details provided above for various parameters:
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